Patents/Inventors

Hyeondong Song

Suwon-siKR5 patents

6 Patents

USD11039492025
CMP (chemical Mechanical Planarization) Retaining Ring
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
USD11031312025
CMP (chemical Mechanical Planarization) Retaining Ring
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
USD10860872025
CMP (chemical Mechanical Planarization) Retaining Ring
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
USD10635952025
CMP (chemical Mechanical Planarization) Retaining Ring
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
USD10626622025
CMP (chemical Mechanical Planarization) Retaining Ring
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116580572023
Wafer Chuck
SAMSUNG ELECTRONICS CO., Ltd.
0 cites