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Patents/USD1103949

CMP (chemical Mechanical Planarization) Retaining Ring

USD1103949No. D 1,103,949designGranted 12/2/2025

Claims (1)

Claim 1 (Independent)

The ornamental design for a CMP (chemical mechanical planarization) retaining ring as shown and described.

Full Description

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FIG. 1 is a front perspective view of a CMP (chemical mechanical planarization) retaining ring showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left-side view thereof;

FIG. 5 is a right-side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a bottom rear perspective view thereof;

FIG. 9 is an enlarged view of the delineated portion 9 in FIG. 1 ;

FIG. 10 is an enlarged view of the delineated portion 10 in FIG. 2 ;

FIG. 11 is an enlarged view of the delineated portion 11 in FIG. 8 ;

FIG. 12 is a cross sectional view taken through the line 12 - 12 of FIG. 6 ; and,

FIG. 13 is an enlarged view of the delineated portion 13 in FIG. 12 .

The evenly dashed broken lines in the figures depict portions of the CMP (chemical mechanical planarization) retaining ring that form no part of the claimed design. The dot-dash broken lines delineating portions of the claimed design that are illustrated in enlargements form no part of the claimed design.

Citations

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