Patents/Inventors

Joonsuk Jeong

Suwon-siKR1 patent

2 Patents

USD11039492025
CMP (chemical Mechanical Planarization) Retaining Ring
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
USD11031312025
CMP (chemical Mechanical Planarization) Retaining Ring
SAMSUNG ELECTRONICS CO., Ltd.
0 cites