Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12418001utility2025
3D Integrated Circuit (3DIC) Structure
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US12417973utility2025
Semiconductor Packaging Structure and Method for Manufacturing the Same
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US12417970utility2025
Method for Forming Chip Package Structure
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US12417968utility2025
Package Structure and Forming Method Thereof
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US12417955utility2025
Thermal Sensor Device by Back End of Line Metal Resistor
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US12417941utility2025
Isolation Structures in Semiconductor Devices
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US12417799utility2025
Memory Circuit and Write Method
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US12417332utility2025
Integrated Circuit, System for and Method of Forming an Integrated Circuit
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US12416939utility2025
Clock Duty Cycle Adjustment and Calibration Circuit and Method of Operating Same
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US12416864utility2025
Tool Mismatch Reduction Using Aberration Map of the Tools
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US12416862utility2025
Apparatus, System and Method
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US12416853utility2025
EUV Photo Masks and Manufacturing Method Thereof
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US12416529utility2025
Temperature Sensor Circuits and Control Circuits and Method for Temperature Sensor Circuits
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US12416074utility2025
PVD System and Collimator
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US12415718utility2025
Impact-resistant Micromechanical Arms
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US12417796utility2025
Ferroelectric Field-effect Transistor (fefet) Memory
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US12417980utility2025
First Metal Structure, Layout, and Method
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US12419046utility2025
Memory Device
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US12417981utility2025
Semiconductor Device Including Graphene Interconnect and Method of Making the Semiconductor Device
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US12414479utility2025
Sub 60nm Etchless MRAM Devices by Ion Beam Etching Fabricated T-shaped Bottom Electrode
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