Composite Seal for Semiconductor Manufacturing Device
USD1071887No. D 1,071,887designGranted 4/22/2025
Claims (1)
Claim 1 (Independent)
The ornamental design for a composite seal for semiconductor manufacturing device as shown and described.
Full Description
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1. Composite seal for semiconductor manufacturing device
1 . 1 : Perspective
1 . 2 : Top
1 . 3 : Front
1 . 4 : Cross section taken along line 1 . 4 - 1 . 4 in view 1 . 2
1 . 5 : Enlarged portion view taken from encircled portion labeled, “ 1 . 5 ,” in view 1 . 4
1 . 6 : Right
1 . 7 : Bottom
1 . 8 : Back
1 . 9 : Left
The dot-dashed lines show the boundary of the enlarged view of 1 . 5 in views 1 . 4 and 1 . 5 and form no part of the claimed design.
Citations
This patent cites (43)
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