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Patents/USD1066274

Heat Sink for Memory Module

USD1066274No. D 1,066,274designGranted 3/11/2025

Claims (1)

Claim 1 (Independent)

The ornamental design for a heat sink for memory module as shown and described.

Full Description

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FIG. 1 is a perspective view of a heat sink for memory module showing the claimed design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is an enlarged left side elevational view thereof;

FIG. 6 is an enlarged right side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is an enlarged view illustrating the details of the dot-dash area “ 9 ” indicated in FIG. 1 ; and,

FIG. 10 is an enlarged view illustrating the details of the dot-dash area “ 10 ” indicated in FIG. 8 .

The dash-dash broken lines in the drawings illustrate environmental subject matter and portions of the article that form no part of the claimed design.

The dot-dash lines in the figures represent the boundaries of the enlarged areas in which the dot-dash lines, lead line and numeral designation form no part of the claimed design.

Citations

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