Claims (1)
Claim 1 (Independent)
The ornamental design for a heat sink for memory module as shown and described.
Full Description
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FIG. 1 is a perspective view of a heat sink for memory module showing the claimed design;
FIG. 2 is another perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
The broken lines in the drawings depict portions of the heat sink for memory module that form no part of the claimed design.
Citations
This patent cites (14)
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