Claims (1)
Claim 1 (Independent)
The ornamental design for a power semiconductor module, as shown and described.
Full Description
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FIG. 1 is a front, top and right side perspective view of a second embodiment of a power semiconductor module showing our new design;
FIG. 2 is a front view thereof, the rear view being an identical image of FIG. 2 ;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof; and,
FIG. 5 is a right side view thereof, the left side view being an identical image of FIG. 5 .
The broken lines illustrate portions of the power semiconductor module that form no part of the claimed design.
Citations
This patent cites (14)
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