Claims (1)
Claim 1 (Independent)
The ornamental design for a semiconductor package, as shown and described.
Full Description
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FIG. 1 is a top perspective view of a semiconductor package;
FIG. 2 is a bottom perspective view of the semiconductor package of FIG. 1 ;
FIG. 3 is a top view of the semiconductor package of FIG. 1 ;
FIG. 4 is a bottom view of the semiconductor package of FIG. 1 ;
FIG. 5 is a side view of the semiconductor package of FIG. 1 ;
FIG. 6 is an opposing side view of the semiconductor package of FIG. 1 ;
FIG. 7 is an end view of the semiconductor package of FIG. 1 ; and,
FIG. 8 is an opposing end view of the semiconductor package of FIG. 1 .
The broken lines shown in the drawings depict portions of the semiconductor package that form no part of the claimed design.
Citations
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