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Patents/USD1056862

Semiconductor Package

USD1056862No. D 1,056,862designGranted 1/7/2025

Claims (1)

Claim 1 (Independent)

The ornamental design for a semiconductor package, as shown and described.

Full Description

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FIG. 1 is a top perspective view of a semiconductor package;

FIG. 2 is a bottom perspective view of the semiconductor package of FIG. 1 ;

FIG. 3 is a top view of the semiconductor package of FIG. 1 ;

FIG. 4 is a bottom view of the semiconductor package of FIG. 1 ;

FIG. 5 is a side view of the semiconductor package of FIG. 1 ;

FIG. 6 is an opposing side view of the semiconductor package of FIG. 1 ;

FIG. 7 is an end view of the semiconductor package of FIG. 1 ; and,

FIG. 8 is an opposing end view of the semiconductor package of FIG. 1 .

The broken lines shown in the drawings depict portions of the semiconductor package that form no part of the claimed design.

Citations

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