Claims (1)
Claim 1 (Independent)
The ornamental design for a power semiconductor module, as shown and described.
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is a front, top and right side perspective view of a power semiconductor module according to our new design;
is a front view thereof, the rear view being an identical image of ;
is a top plan view thereof;
is a bottom plan view thereof; and,
is a right side view thereof, the left side view being an identical image of .
Figures (5)
Citations
This patent cites (35)
- US3352726
- USD327883
- USD357909
- USD393458
- USD394244
- USD470463
- USD472530
- USD642996
- USD664506
- USD692843
- USD701843
- USD832227
- US10262928
- USD904325
- USD930601
- USD934821
- USD973029
- US11522058
- US11538936
- USD981356
- USD994624
- USD1021831
- USD1030686
- USD1056861
- US2008/0197471
- US2016/0104654
- US2019/0115465
- US2019/0304946
- US2021/0296226
- US2022/0319975
- US2023/0037158
- US2023/0082976
- US2024/0321676
- US1664282
- USD216708