Patents/Inventors

Yun Hwa Choi

BusanKR12 patents

14 Patents

US124475502025
Ultrasonic Welding System and Power Module Package for Power Converting Apparatus to Which Substrate Where Connection Member Is Ultrasonic Welded by Using the Same Is Applied
JMJ Korea Co., Ltd.
0 cites
US124514102025
Semiconductor Package Module Including Vertical Terminals
JMJ Korea Co., Ltd.
0 cites
US124009912025
Clip Structure for Semiconductor Package and Semiconductor Package Including the Same
JMJ Korea Co., Ltd.
0 cites
US121702602024
Semiconductor Package and Method of Manufacturing the Same
JMJ Korea Co., Ltd.
0 cites
USD10490652024
Semiconductor Package
JMJ KOREA CO., Ltd.
0 cites
US120274452024
System for Cooling Semiconductor Component, Method of Manufacturing the Same, and Semiconductor Package Having the System
JMJ Korea Co., Ltd.
0 cites
US119087662024
Cooling System Where Semiconductor Component Comprising Semiconductor Chip and Cooling Apparatus Are Joined
JMJ Korea Co., Ltd.
0 cites
US119088242024
Semiconductor Package, Method of Manufacturing the Same and Metal Bridge Applied to the Semiconductor Package
JMJ Korea Co., Ltd.
0 cites
US118239202023
Apparatus for Attaching Semiconductor Parts
JMJ Korea Co., Ltd.
0 cites
US117988642023
Semiconductor Package with Metal Post Having Non-vertical Structure
JMJ Korea Co., Ltd.
0 cites
US117216152023
Coupled Semiconductor Package
JMJ Korea Co., Ltd.
0 cites
US116826102023
Semiconductor Package with Heat Radiation Board
JMJ Korea Co., Ltd.
0 cites
US116769312023
Semiconductor Package
JMJ Korea Co., Ltd.
0 cites
US116316272023
Method of Manufacturing Semiconductor Having Double-sided Substrate
JMJ Korea Co., Ltd.
0 cites