80 Patents
- US126160272026Semiconductor Package Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US126077632026Capacitive Sensing System Using Active Shielding and Operating Method Thereof
PIXART IMAGING Inc.
0 cites - US125997592026Non-implantable Training Method for Training Genioglossus Muscle Strength
METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
0 cites - US125936932026Package Lid with a Vapor Chamber Base Having an Angled Portion and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - 0 cites
- US125688202026Semiconductor Package Including Lid with Integrated Heat Pipe for Thermal Management and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US125688242026Package Assembly Including Liquid Alloy Thermal Interface Material (TIM) and Seal Ring Around the Liquid Alloy TIM and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US125335082026In Vitro Training Method and Device for Improving Sleep Apnea
METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
0 cites - US124807872025Touch Sensing System, Multi Sensor Device and Vehicle Control Device
Pixart Imaging Inc.
0 cites - US124698142025Integrated Circuit Package and Method of Forming Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - 0 cites
- US124427422025Test Structures to Determine Integrated Circuit Bonding Energies and Methods of Making and Using the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US124245582025Bridge Die Having Different Surface Orientation Than IC Dies Interconnected by the Bridge Die
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US124069362025Semiconductor Package with Substrate Recess and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US124068972025Package Structure with Buffer Layer Embedded in Lid Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US123879912025Manufacturing Method of Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US123622462025Interposer Including Stepped Surfaces and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123622582025Thermal Module for a Semiconductor Package and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123622682025Package Assembly Including Package Substrate with Elongated Solder Resist Opening and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123622992025Basin-shaped Underbump Plates and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123623072025Semiconductor Package with Ball Grid Array Connection Having Improved Reliability
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123621972025Semiconductor Die Package with Ring Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US123449742025Circular Knitting Machine with Real-time Prompt of Knitting Machine Status
PAI LUNG MACHINERY MILL CO., Ltd.
0 cites - US123277722025Semiconductor Package Including Stress-reduction Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - 0 cites
- US123226662025Package Assembly Lid and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123157682025Package Assembly Including Lid with Additional Stress Mitigating Feet and Methods of Making the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123151062025Frame Sequence Quality Booster Using Information in an Information Repository
Mediatek Inc.
0 cites - US123083462025Semiconductor Die with Tapered Sidewall in Package
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US122551192025Package Assembly Including Liquid Alloy Thermal Interface Material (TIM) and Seal Ring Around the Liquid Alloy TIM and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US122551182025Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122345692025Non-enzyme Sensor, Non-enzyme Sensor Element and Fabricating Method Thereof
NATIONAL TSING HUA UNIVERSITY
0 cites - US122180232025Semiconductor Package and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US121950732025Pressure Sensing Device, 3D Gesture Control System and Vehicle Control System
Pixart Imaging Inc.
0 cites - US121912942025Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US121837142024Package Structures and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121548962024Three-dimensional Integrated Circuit Packages and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US121192962024Encircling a Semiconductor Device with Stacked Frames on a Substrate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US120877052024Package Structure with Warpage-control Element
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120741012024Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120740832024Semiconductor Die Package with Thermal Management Features
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US120402852024Structure and Formation Method of Chip Package with Reinforcing Structures
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120339062024Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120339132024Chip Package Structure with Lid and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120338712024Method for Forming Semiconductor Die Package with Ring Structure Comprising Recessed Parts
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120092782024Package Structure with Buffer Layer Embedded in Lid Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120104562024Method for Performing Frame Interpolation Based on Single-directional Motion and Associated Non-transitory Machine-readable Medium
MEDIATEK Inc.
0 cites - US120092762024Semiconductor Package Including Lid with Integrated Heat Pipe for Thermal Management and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - 0 cites
- US119904182024Chip Package Structure with Buffer Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119843782024Semiconductor Package Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US119159912024Semiconductor Device Having First Heat Spreader and Second Heat Spreader and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119139252024Sensing Devices and Calibration Method Thereof
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
0 cites - 0 cites
- US118549292023Semiconductor Package and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118239912023Frames Stacked on Substrate Encircling Devices and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118238872023Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118153692023Differential Capacitor Device and Method for Calibrating Differential Capacitor
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
0 cites - US117841302023Structure and Formation Method of Package with Underfill
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117840612023Chip Package Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117568542023Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117394502023Circular Knitting Machine for Prompting Knitting Machine Status Instantaneously Based on Cloth Surface Status of Fabric
PAI LUNG MACHINERY MILL CO., Ltd.
0 cites - US117157312023Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116769162023Structure and Formation Method of Package with Warpage-control Element
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116768262023Semiconductor Die Package with Ring Structure for Controlling Warpage of a Package Substrate
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116569092023Tensor Accelerator Capable of Increasing Efficiency of Data Sharing
National Taiwan University
0 cites - 0 cites
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