9 Patents
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- US124762192025Wire Bonding State Determination Method and Device Using a Prescribed Electric Waveform
Yamaha Robotics Co., Ltd.
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- US124380532025Ultrasound Vibrating-type Defect Detection Apparatus and Wire Defect Detection System
Yamaha Robotics Holdings Co., Ltd.
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- US115882192023Feed Portion for Coupling to a Waveguide Formed in a Substrate, Where the Feed Portion Includes Vias Connected to a Connection Pad
NGK SPARK PLUG CO., Ltd.
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