175 Patents
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- US126155672026Configuration for Layer 1 or Layer 2 Triggered Mobility (LTM) for Cell Switching
Comcast Cable Communications, LLC
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- US125684162026Configuration Handling for Subsequent Layer 1 or Layer 2 Triggered Mobility in Dual Connectivity
Ofinno, LLC
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- US125013322025Layer 1/layer 2 Triggered Mobility Cancelation Initiated by Target Base Station
Ofinno, LLC
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- US124954462025Slidelink Transmission Method and Apparatus Based on Sidelink Listen-before-talk Failure on a Shared Spectrum
Ofinno, LLC
0 cites - US124954902025Printed Circuit Board and Manufacturing Method Thereof
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US124397942025Display Panel Having Each Active Area Gate-in-panel (AAGIP) Unit Disposed Between Adjacent Ones of the Plurality of Pixel Blocks and Display Device Including the Same
LG Displays Co., Ltd.
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- US124112522025Method for Recognizing Vehicle Location Using Geomagnetic Sensor
Korea Institute Of Science And Technology
0 cites - US124115372025Power Reduction for Systems Having Multiple Ranks of Memory
Samsung Electronics Co., Ltd.
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- US123720962025Ventilating Apparatus, Circuit Assembly and Control Method of the Same
SAMSUNG ELECTRONICS CO., Ltd.
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- US122255382025Configuration for Wireless Communication in Inactive or Idle States
Comcast Cable Communications, LLC
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- US122133162025Semiconductor Devices and Data Storage Systems Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
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- US121563902024Electromagnetic Wave Shielding Film, and Method for Manufacturing Same
LG ELECTRONICS Inc.
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- US121320192024Packaged Multi-chip Semiconductor Devices and Methods of Fabricating Same
Samsung Electronics Co., Ltd.
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- US120962112024Method for Performing V2X Communication in Wireless Communication System and Device for Same
LG ELECTRONICS Inc.
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- US120794912024Memory System Including Memory Device and Memory Controller, and Operating Method Thereof
Dongguk University Industry-academic Cooperation Foundation
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- US120586782024Method and Apparatus for Resource Allocation in Wireless Communication System
LG ELECTRONICS Inc.
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- US120403132024Semiconductor Package and a Method for Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US120351632024Method and Apparatus for Measurement Logging and Reporting in Wireless Communication System
LG ELECTRONICS Inc.
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- US120039832024Activation of Secondary Cell Group Configuration Upon Master Cell Group Failure Detection
LG ELECTRONICS Inc.
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- US119915522024SDAP Reconfiguration Based on State Transition in Sidelink Communication
LG ELECTRONICS Inc.
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- US119855962024Sidelink Resource Allocation Mode Switching Based on Power State Transitioning
Ofinno, LLC
0 cites - US119857172024Handling Minimum Required Communication Range in Sidelink Communication
LG ELECTRONICS Inc.
0 cites - US119845362024Semiconductor Light Emitting Device and Light Emitting Device Package Having the Same
Samsung Electronics Co., Ltd.
0 cites - US119855652024Method and Apparatus for Mobility Management in Wireless Communication System
LG ELECTRONICS Inc.
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- US119783872024Display Device and Display Driving Method That Controls a Level of Bias Voltage Applied to a Source Electrode of a Drive Transistor
LG DISPLAY CO., Ltd.
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- US118880912024Semiconductor Light Emitting Device and Light Emitting Device Package
SAMSUNG ELECTRONICS CO., Ltd.
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- US118713782024Deactivation of Configured Grant and Initiation of Connection Request Upon Detection of Sidelink Failure
LG ELECTRONICS Inc.
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- US117641922023Semiconductor Package Including Underfill Material Layer and Method of Forming the Same
Samsung Electronics Co., Ltd.
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- US117006662023Method and Apparatus for Triggering Transmission Carrier Selection in Wireless Communication System
LG Electronics Inc.
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- US116783992023Method and Apparatus for Resuming Only Signaling Radio Bearers in Wireless Communication System
LG Electronics Inc.
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- US116769252023Semiconductor Packages Having Improved Reliability in Bonds Between Connection Conductors and Pads and Methods of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites - US116581412023Die-to-wafer Bonding Structure and Semiconductor Package Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US116581482023Semiconductor Package and a Method for Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
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- US116383252023Method and Apparatus for Triggering Transmission Carrier Selection in Wireless Communication System
LG Electronics Inc.
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- US116067342023Handover Method in Wireless Communication System and Apparatus Therefor
LG ELECTRONICS Inc.
0 cites - US115959392023Method and Apparatus for Controlling Transmission of Response Signal in Wireless Communication System
LG ELECTRONICS Inc.
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- US115589172023Method for Performing Path Reselection in Wireless Communication System and Apparatus Therefor
LG ELECTRONICS Inc.
0 cites - US115520332023Packaged Multi-chip Semiconductor Devices and Methods of Fabricating Same
Samsung Electronics Co., Ltd.
0 cites - US115535502023Method and Apparatus for Supporting Security in RRC Inactive State in Wireless Communication System
LG Electronics Inc.
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