116 Patents
- US126160292026Package Structure with Stiffener Ring Having Slant Sidewall
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US125688202026Semiconductor Package Including Lid with Integrated Heat Pipe for Thermal Management and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US125576452026Semiconductor Packages with Thermal Lid and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US125576562026Stacking via Structures for Stress Reduction
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - 0 cites
- US125388522026Package Structure Containing Chip Structure with Inclined Sidewalls
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US125124322025Dicing Process in Packages Comprising Organic Interposers
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US125123992025Semiconductor Package and Method of Manufacture
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US125002082025Integrated Fan-out Package Having Stress Release Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US124890272025Semiconductor Device and Method of Manufacture
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US124698142025Integrated Circuit Package and Method of Forming Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - 0 cites
- US124245112025High Efficiency Heat Dissipation Using Discrete Thermal Interface Material Films
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US124179702025Method for Forming Chip Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124128272025Semiconductor Die Package with Conductive Line Crack Prevention Design
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US124069362025Semiconductor Package with Substrate Recess and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US124068972025Package Structure with Buffer Layer Embedded in Lid Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123947522025Multi-chip Device and Method of Formation
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123946982025Underfill Cushion Films for Packaging Substrates and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123879912025Manufacturing Method of Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123746362025Semiconductor Device Package with Stress Reduction Design
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US123681142025Semiconductor Device Package Having Warpage Control and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123681272025Semiconductor Chip Package Having Underfill Material Surrounding a Fan-out Package and Contacting a Stress Buffer Structure Sidewall
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123680802025Chip Package Structure with Ring Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123621972025Semiconductor Die Package with Ring Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123622682025Package Assembly Including Package Substrate with Elongated Solder Resist Opening and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123549282025Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US123477642025Organic Interposer Including Intra-die Structural Reinforcement Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123277722025Semiconductor Package Including Stress-reduction Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123227032025Eccentric via Structures for Stress Reduction
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - 0 cites
- US123226662025Package Assembly Lid and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123157682025Package Assembly Including Lid with Additional Stress Mitigating Feet and Methods of Making the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123083462025Semiconductor Die with Tapered Sidewall in Package
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US123005682025High Efficiency Heat Dissipation Using Discrete Thermal Interface Material Films
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US122835532025Semiconductor Die with Warpage Release Layer Structure in Package and Fabricating Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US122666352025Semiconductor Device Package Having Dummy Dies
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122551562025Semiconductor Package with Riveting Structure Between Two Rings and Method for Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US122551182025Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US122372772025Package Structure and Methods of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US122323072025Dummy Metal Bonding Pads for Underfill Application in Semiconductor Die Packaging and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US122180232025Semiconductor Package and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121912942025Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121837142024Package Structures and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121702382024Semiconductor Die Package with Multi-lid Structures and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121548962024Three-dimensional Integrated Circuit Packages and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US121258222024Method of Manufacturing a Semiconductor Device Package Having Dummy Dies
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121192962024Encircling a Semiconductor Device with Stacked Frames on a Substrate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US121006642024Semiconductor Device with Curved Conductive Lines and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US120948282024Eccentric via Structures for Stress Reduction
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US120740832024Semiconductor Die Package with Thermal Management Features
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120741012024Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120682602024Semiconductor Die Package with Ring Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120402672024Organic Interposer Including Intra-die Structural Reinforcement Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US120339132024Chip Package Structure with Lid and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120339282024Manufacturing Method of Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120339472024Semiconductor Package Structure and Method for Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120338712024Method for Forming Semiconductor Die Package with Ring Structure Comprising Recessed Parts
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120339062024Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120210422024Semiconductor Package and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120092782024Package Structure with Buffer Layer Embedded in Lid Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120092762024Semiconductor Package Including Lid with Integrated Heat Pipe for Thermal Management and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US119978422024Dummy Metal Bonding Pads for Underfill Application in Semiconductor Die Packaging and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US119963462024Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119843782024Semiconductor Package Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119787222024Structure and Formation Method of Package Containing Chip Structure with Inclined Sidewalls
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119730012024Semiconductor Device and Method of Manufacture
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US119675822024Multi-chip Device and Method of Formation
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
0 cites - US119675472024Solder Resist Structure to Mitigate Solder Bridge Risk
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US119159912024Semiconductor Device Having First Heat Spreader and Second Heat Spreader and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119087572024Die Corner Removal for Molding Compound Crack Suppression in Semiconductor Die Packaging and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US118943202024Semiconductor Device Package with Stress Reduction Design and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US118625282024Method for Forming Semiconductor Package
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US118549562023Semiconductor Die Package with Conductive Line Crack Prevention Design
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US118550082023Stacking via Structures for Stress Reduction
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- 0 cites
- US118549292023Semiconductor Package and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118308002023Metallization Structure and Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118308592023Package Structures and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US118239912023Frames Stacked on Substrate Encircling Devices and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118238872023Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117988972023Package Structure and Methods of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117841302023Structure and Formation Method of Package with Underfill
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117840612023Chip Package Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117568542023Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117496442023Semiconductor Device with Curved Conductive Lines and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US117423222023Integrated Fan-out Package Having Stress Release Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117282332023Chip Package Structure with Ring Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US117216442023Semiconductor Package with Riveting Structure Between Two Rings and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US117157312023Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116996682023Semiconductor Device Package Having Warpage Control and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116996312023Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116949742023Semiconductor Die with Warpage Release Layer Structure in Package and Fabricating Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116949412023Semiconductor Die Package with Multi-lid Structures and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116826022023Semiconductor Device and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US116768262023Semiconductor Die Package with Ring Structure for Controlling Warpage of a Package Substrate
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116706012023Stacking via Structures for Stress Reduction
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US116520372023Semiconductor Package and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US116370722023Semiconductor Package and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116370872023Multi-chip Device and Method of Formation
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
0 cites - US116108352023Organic Interposer Including Intra-die Structural Reinforcement Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US115944772023Semiconductor Package and Method of Manufacturing Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites