Patents/Inventors

Shin-puu Jeng

Po-Shan VillageTW160 patents

266 Patents

US126223142026
Dam Structure for Integrated Passive Device Integration and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US126160292026
Package Structure with Stiffener Ring Having Slant Sidewall
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US126160272026
Semiconductor Package Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US126047652026
Integrated Passive Device Dies and Methods of Forming and Placement of the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US125688202026
Semiconductor Package Including Lid with Integrated Heat Pipe for Thermal Management and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US125688242026
Package Assembly Including Liquid Alloy Thermal Interface Material (TIM) and Seal Ring Around the Liquid Alloy TIM and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US125640762026
Chip Package with Fan-out Feature and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US125576562026
Stacking via Structures for Stress Reduction
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US125576452026
Semiconductor Packages with Thermal Lid and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US125507572026
Chip Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US125507702026
Embedded Stress Absorber in Package
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US125507922026
Semiconductor Package and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125388192026
Inductor RF Isolation Structure in an Interposer and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US125388522026
Package Structure Containing Chip Structure with Inclined Sidewalls
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US125327712026
Package Structure with Fan-out Feature
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US125123822025
Semiconductor Device Including Stress Control Layer and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US125123992025
Semiconductor Package and Method of Manufacture
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US125124322025
Dicing Process in Packages Comprising Organic Interposers
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US125060902025
Semiconductor Package Including Stress Buffers and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US125060082025
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125002082025
Integrated Fan-out Package Having Stress Release Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125001582025
Semiconductor Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US124944362025
Integrated Passive Device Dies and Methods of Forming and Placement of the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US124890432025
Reconstructed Substrates for High I/O Counts Application and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US124890272025
Semiconductor Device and Method of Manufacture
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US124890292025
Redistribution Structure with Warpage Tuning Layer
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US124827802025
Chip Package Structure Including an Underfill Material Portion Comprising a Cut Region
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US124762232025
Semiconductor Package and Method of Manufacturing the Same
Taiwan Semiconducotr Manufacturing Company, Ltd.
0 cites
US124762132025
Semiconductor Package and Method of Manufacturing
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124761982025
Package Structure with Adhesive Element Over Semiconductor Chip
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124762032025
Stiffener Structure with Beveled Sidewall for Footprint Reduction and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US124698142025
Integrated Circuit Package and Method of Forming Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US124631612025
Semiconductor Device and Method of Manufacture
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124514352025
3D Stacking Architecture Through TSV and Methods Forming Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US124446632025
Semiconductor Package Including a Semiconductor Die Disposed in a Cavity and Method for Manufacturing Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124446962025
Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124314152025
Buffer Block Structures for C4 Bonding and Methods of Using the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US124245862025
Bridging-resistant Microbump Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US124245112025
High Efficiency Heat Dissipation Using Discrete Thermal Interface Material Films
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US124245322025
Bump Joint Structure with Distortion and Method Forming Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US124179702025
Method for Forming Chip Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124128272025
Semiconductor Die Package with Conductive Line Crack Prevention Design
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124128512025
Semiconductor Device and Method of Manufacture
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124068982025
Chip Package Structure with Lid
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124069362025
Semiconductor Package with Substrate Recess and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US124068972025
Package Structure with Buffer Layer Embedded in Lid Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124009992025
Semiconductor Devices and Methods of Manufacture
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123947582025
Packages with Metal Line Crack Prevention Design
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123946982025
Underfill Cushion Films for Packaging Substrates and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123947522025
Multi-chip Device and Method of Formation
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123880282025
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123879452025
Semiconductor Structures Including Glass Core Layer and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123879912025
Manufacturing Method of Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123879922025
Package and Method for Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123811802025
Multi-chip Packages and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123746362025
Semiconductor Device Package with Stress Reduction Design
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123745612025
Chip Package Structure with Ring Dam
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123681272025
Semiconductor Chip Package Having Underfill Material Surrounding a Fan-out Package and Contacting a Stress Buffer Structure Sidewall
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123681422025
Double Side Integration Semiconductor Package and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123680802025
Chip Package Structure with Ring Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123681092025
Interposer Structure for Semiconductor Package Including Peripheral Metal Pad Around Alignment Mark and Methods of Fabricating Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123681142025
Semiconductor Device Package Having Warpage Control and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123622992025
Basin-shaped Underbump Plates and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123623412025
Semiconductor Devices and Methods of Manufacturing
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123622762025
Semiconductor Package Having a Semiconductor Device Bonded to a Circuit Substrate Through a Floated or Grounded Dummy Conductor and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123622562025
Method for Forming Semiconductor Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123621972025
Semiconductor Die Package with Ring Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123549892025
Package Structure with Conductive via Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123549282025
Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123549382025
Semiconductor Package and Methods of Manufacturing
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123549402025
Redistribution Layer Structure with Support Features and Methods
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123550012025
Semiconductor Package Structure and Method for Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123477932025
Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123477582025
Dual-underfill Encapsulation for Packaging and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123477642025
Organic Interposer Including Intra-die Structural Reinforcement Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123410912025
Semiconductor Packages Having Conductive Patterns of Redistribution Structure Having Ellipse-like Shape
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123344512025
Semiconductor Package Including Package Substrate with Dummy via and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123277722025
Semiconductor Package Including Stress-reduction Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123227422025
Semiconductor Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US123226662025
Package Assembly Lid and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123227032025
Eccentric via Structures for Stress Reduction
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123227042025
Package Structure with Underfill
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123157682025
Package Assembly Including Lid with Additional Stress Mitigating Feet and Methods of Making the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123083462025
Semiconductor Die with Tapered Sidewall in Package
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123083222025
Dual-sided Routing in 3D Semiconductor System-in-package Structure and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123083212025
Structures to Increase Substrate Routing Density and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123083132025
Semiconductor Package with Improved Interposer Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123006322025
Chip Package with Lid
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123005682025
High Efficiency Heat Dissipation Using Discrete Thermal Interface Material Films
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123005922025
Fan-out Package with Controllable Standoff
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123006192025
Interposer with Die to Die Bridge Solution and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US122835532025
Semiconductor Die with Warpage Release Layer Structure in Package and Fabricating Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US122781562025
Semiconductor Package
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US122726292025
Semiconductor Device Having an Integrated Device Positioned Within a Hybrid Interposer That Includes Organic and Non-organic Materials
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US122666352025
Semiconductor Device Package Having Dummy Dies
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US122611022025
Semiconductor Package and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122551562025
Semiconductor Package with Riveting Structure Between Two Rings and Method for Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US122551192025
Package Assembly Including Liquid Alloy Thermal Interface Material (TIM) and Seal Ring Around the Liquid Alloy TIM and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US122551182025
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122550782025
Semiconductor Devices and Methods of Manufacturing
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US122495502025
Semiconductor Package and Method Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122495682025
Metallization Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122438002025
Package Structure with Lid and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US122372622025
Semiconductor Package with Improved Interposer Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US122372762025
Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US122372772025
Package Structure and Methods of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122323072025
Dummy Metal Bonding Pads for Underfill Application in Semiconductor Die Packaging and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US122242662025
Semiconductor Packages Including Passive Devices and Methods of Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US122180952025
Chip Package Structure Having Molding Layer
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US122180802025
Package Structure with Reinforced Element
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US122180232025
Semiconductor Package and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122058612025
Manufacturing Method of Semiconductor Package Including Forming Cavity in Circuit Substrate Without Exposing Floor Plate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121990842025
Fan-out Package with Cavity Substrate
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121989962025
Integrated Fan-out Package, Package-on-package Structure, and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121912612025
Semiconductor Device Including Electromagnetic Interference (EMI) Shielding and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US121912722025
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121912942025
Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121837142024
Package Structures and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121763372024
Semiconductor Devices and Methods of Manufacturing
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US121763012024
Package Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121762582024
Semiconductor Package and Method Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121702382024
Semiconductor Die Package with Multi-lid Structures and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121702742024
Semiconductor Packages and Methods of Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US121660252024
Semiconductor Devices and Methods of Manufacturing
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US121659802024
Semiconductor Package and Methods of Manufacturing
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121548882024
Semiconductor Package and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121548962024
Three-dimensional Integrated Circuit Packages and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121486842024
Package Structure and Method
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US121319842024
Heterogeneous Fan-out Structure and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121320212024
Method for Fabricating Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121258332024
Integrated Circuit Package and Method Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US121258222024
Method of Manufacturing a Semiconductor Device Package Having Dummy Dies
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121257552024
Chip Package Structure with Cavity in Interposer
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd
0 cites
US121192962024
Encircling a Semiconductor Device with Stacked Frames on a Substrate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121130332024
Chip Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121130062024
Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121130252024
Semiconductor Package with Dual Sides of Metal Routing
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121006642024
Semiconductor Device with Curved Conductive Lines and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US121006662024
Method for Forming Chip Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120948192024
Method for Forming Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120948102024
Reinforcing Package Using Reinforcing Patches
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120948282024
Eccentric via Structures for Stress Reduction
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US120877052024
Package Structure with Warpage-control Element
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120741042024
Integrated Circuit Packages with Ring-shaped Substrates
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120740832024
Semiconductor Die Package with Thermal Management Features
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120741012024
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120682602024
Semiconductor Die Package with Ring Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120573632024
Chip Package Structure with Multiple Gap-filling Layers and Fabricating Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120574242024
Package Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120516542024
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120465482024
Chip Package with Redistribution Structure Having Multiple Chips
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120402672024
Organic Interposer Including Intra-die Structural Reinforcement Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US120402852024
Structure and Formation Method of Chip Package with Reinforcing Structures
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120339282024
Manufacturing Method of Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120339472024
Semiconductor Package Structure and Method for Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120354752024
Semiconductor Package with Stress Reduction Design and Method for Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120339062024
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120339132024
Chip Package Structure with Lid and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120338712024
Method for Forming Semiconductor Die Package with Ring Structure Comprising Recessed Parts
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120210142024
Bump Joint Structure with Distortion and Method Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US120210642024
Semiconductor Devices and Methods of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US120210452024
Semiconductor Device and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120149692024
Package Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120092762024
Semiconductor Package Including Lid with Integrated Heat Pipe for Thermal Management and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US120092782024
Package Structure with Buffer Layer Embedded in Lid Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119966062024
Heterogeneous Antenna in Fan-out Package
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119978422024
Dummy Metal Bonding Pads for Underfill Application in Semiconductor Die Packaging and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US119963722024
Semiconductor Device and Method of Manufacture
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119963462024
Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119904182024
Chip Package Structure with Buffer Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119843782024
Semiconductor Package Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119843812024
Semiconductor Package Structure and Method for Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119844052024
Pad Structure Design in Fan-out Package
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119787222024
Structure and Formation Method of Package Containing Chip Structure with Inclined Sidewalls
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119730012024
Semiconductor Device and Method of Manufacture
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US119675822024
Multi-chip Device and Method of Formation
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
0 cites
US119675472024
Solder Resist Structure to Mitigate Solder Bridge Risk
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119617792024
3DIC Packaging with Hot Spot Thermal Management Features
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC).
0 cites
US119554552024
Embedded Stress Absorber in Package
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US119489142024
Chip Package Structure with Integrated Device Integrated Beneath the Semiconductor Chip
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119488922024
Formation Method of Chip Package with Fan-out Feature
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119424082024
Semiconductor Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US119358422024
Methods of Manufacturing an Integrated Circuit Having Stress Tuning Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119159922024
Method for Forming Package Structure with Lid
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119159912024
Semiconductor Device Having First Heat Spreader and Second Heat Spreader and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119087572024
Die Corner Removal for Molding Compound Crack Suppression in Semiconductor Die Packaging and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US119087642024
Semiconductor Package Including a Circuit Substrate Having a Cavity and a Floor Plate Embedded in a Dielectric Material and a Semiconductor Die Disposed in the Cavity
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119012792024
Semiconductor Package and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119013072024
Semiconductor Device Including Electromagnetic Interference (EMI) Shielding and Method of Manufacture
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US119012772024
Semiconductor Package and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118943202024
Semiconductor Device Package with Stress Reduction Design and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
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Semiconductor Device Encapsulated by Molding Material Attached to Redistribution Layer
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