16 Patents
- US125990402026Three-dimensional Integrated Circuit Structure and a Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
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- US121070342024Semiconductor Chip and Semiconductor Package Including Same
SAMSUNG ELECTRONICS CO., Ltd.
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- US118459812023Delayed Pyrophosphorolysis Activated Polymerization0 cites
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- US117283112023Semiconductor Devices Including Interposer Substrates Further Including Capacitors
Samsung Electronics Co., Ltd.
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