12 Patents
- US126085302026Integrated Circuit Including Standard Cell and Method of Manufacturing the Integrated Circuit
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US125882492026Integrated Circuit Devices Including a Cross-coupled Structure
Samsung Electronics Co., Ltd.
0 cites - US125884892026Integrated Circuit Devices Including Stacked Elements and Methods of Forming the Same
Samsung Electronics Co., Ltd.
0 cites - US125576772026Backside Power Distribution Network Semiconductor Architecture Using Direct Epitaxial Layer Connection and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- 0 cites
- US121837382024Cross-coupled Gate Design for Stacked Device with Separated Top-down Gate
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US121441632024Selective Double Diffusion Break Structures for Multi-stack Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US121319962024Stacked Device with Backside Power Distribution Network and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites - US120199652024Integrated Circuit Including Standard Cell and Method of Manufacturing the Integrated Circuit
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
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