Patents/Inventors

Seungwon Im

SeoulKR37 patents

29 Patents

US126222752026
Semiconductor Package Having Cooling Systems with Flow Control Devices Within Substrates
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US126108292026
Power Module Package with Molded via and Dual Side Press-fit Pin
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US125937362026
Power Module Package with Stacked Direct Bonded Metal Substrates
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
USD11137762026
Power Module Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US125502632026
Switching Oscillation Reduction for Power Semiconductor Device Modules
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US125507542026
Current Sharing Mismatch Reduction in Power Semiconductor Device Modules
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124763972025
Transfer Molded Power Modules and Methods of Manufacture
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124712042025
Semiconductor Device Modules
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
USD10980552025
Power Module Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
USD10954742025
Power Module Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124179992025
Semiconductor Packages Using Package in Package Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123680852025
Integration of Semiconductor Device Assemblies with Thermal Dissipation Mechanisms
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123158262025
Semiconductor Device Package Assemblies with Direct Leadframe Attachment
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123006892025
Dual Cool Power Module with Stress Buffer Layer
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122726152025
Thermal Mismatch Reduction in Semiconductor Device Modules
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122306012025
High Power Module Package Structures
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122306062025
Semiconductor Package and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122305512025
Immersion Direct Cooling Modules
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122117712025
Power Module and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122059182025
Submodule Semiconductor Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US121425512024
Package Including Multiple Semiconductor Devices
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119844242024
Semiconductor Packages Using Package in Package Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119675402024
Integrated Circuit Direct Cooling Systems Having Substrates in Contact with a Cooling Medium
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119617822024
Integration of Semiconductor Device Assemblies with Thermal Dissipation Mechanisms
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119013092024
Semiconductor Device Package Assemblies with Direct Leadframe Attachment
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116581712023
Dual Cool Power Module with Stress Buffer Layer
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116520302023
Power Module and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116159672023
Power Module Package and Method of Manufacturing the Same
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US115454212023
Package Including Multiple Semiconductor Devices
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites