Seiyo Nakashima

5 Patents

• US124676892025

  Furnace Opening Structure, Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device

  KOKUSAI ELECTRIC CORPORATION

  0 cites
• US123385292025

  Substrate Processing Apparatus, Process Vessel, Method of Manufacturing Semiconductor Device and Non-transitory Tangible Medium

  Kokusai Electric Corporation

  0 cites
• US120183732024

  Substrate Processing Apparatus

  KOKUSAI ELECTRIC CORPORATION

  0 cites
• USD09825372023

  Separator of Substrate Processing Apparatus

  KOKUSAI ELECTRIC CORPORATION

  0 cites
• USD09819722023

  Adiabatic Plate for Substrate Processing Appratus

  KOKUSAI ELECTRIC CORPORATION

  0 cites