Patents/Inventors

Sangsub Song

Suwon-siKR8 patents

4 Patents

US126222962026
Semiconductor Package Including Metal Pattern Layer with Open Region Which Overlaps Non-contact Pad
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124827892025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122373022025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115692002023
Semiconductor Package and Method of Manufacturing Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites