Patents/Inventors

Sangnam Jeong

Hwaseong-siKR8 patents

3 Patents

US126222962026
Semiconductor Package Including Metal Pattern Layer with Open Region Which Overlaps Non-contact Pad
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US125754232026
Wiring Board and Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121912882025
Integrated Voltage Regulator (IVR) Package Including Inductor and Capacitor and IVR System Package Including the IVR Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites