43 Patents
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UNITED MICROELECTRONICS Corp.
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- US125076042025Semiconductor Memory Device and Fabrication Method Thereof
UNITED MICROELECTRONICS Corp.
0 cites - US123896242025High Electron Mobility Transistor and Method for Forming the Same
UNITED MICROELECTRONICS Corp.
0 cites - US123425622025High Electron Mobility Transistor and Method for Forming the Same Using the Metal Gate Layer and Spacer as an Etch Mask
UNITED MICROELECTRONICS Corp.
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- US122940262025High Electron Mobility Transistor with Improved Barrier Layer
UNITED MICROELECTRONICS Corp.
0 cites - US122740802025High Electron Mobility Transistor Including Conductive Plate Filling Trenches in Passivation Layer, and Method for Forming the Same
UNITED MICROELECTRONICS Corp.
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- US121764142024High Electron Mobility Transistor and Method for Forming the Same
UNITED MICROELECTRONICS Corp.
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- US121426762024High Electron Mobility Transistor and Method for Forming the Same
UNITED MICROELECTRONICS Corp.
0 cites - US120807872024High Electron Mobility Transistor and Method for Fabricating the Same
UNITED MICROELECTRONICS Corp.
0 cites - US120517402024High Electron Mobility Transistor and Method for Forming the Same
UNITED MICROELECTRONICS Corp.
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- US119905392024Semiconductor Device with Conformal Dielectric Layer and Fabricating Method Thereof
UNITED MICROELECTRONICS Corp.
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- US119357882024Semiconductor Die and Manufacturing Method of Semiconductor Device
UNITED MICROELECTRONICS Corp.
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- US118944532024High Electron Mobility Transistor with Improved Barrier Layer
UNITED MICROELECTRONICS Corp.
0 cites - US118880252024Silicon on Insulator (SOI) Device and Forming Method Thereof
UNITED MICROELECTRONICS Corp.
0 cites - US118551742023High Electron Mobility Transistor Having Conductive Plate on Passivation Layer and Method for Forming the Same
UNITED MICROELECTRONICS Corp.
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- US117169122023Method of Forming Multi-bit Resistive Random Access Memory Cell
UNITED MICROELECTRONICS Corp.
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- US116501642023Artificial Neural Network-based Method for Selecting Surface Type of Object
GETAC TECHNOLOGY CORPORATION
0 cites - US115629742023Hybrid Bonding Structure and Method of Fabricating the Same
UNITED MICROELECTRONICS Corp.
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