Patents/Inventors

Po-yao Lin

Hsinchu CountyTW114 patents

158 Patents

US126160292026
Package Structure with Stiffener Ring Having Slant Sidewall
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125936932026
Package Lid with a Vapor Chamber Base Having an Angled Portion and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US125885052026
Thermal and Mechanical Enhanced Thermal Module Structure on Heterogeneous Packages and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US125688242026
Package Assembly Including Liquid Alloy Thermal Interface Material (TIM) and Seal Ring Around the Liquid Alloy TIM and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US125688202026
Semiconductor Package Including Lid with Integrated Heat Pipe for Thermal Management and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US125576562026
Stacking via Structures for Stress Reduction
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US125576452026
Semiconductor Packages with Thermal Lid and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US125507702026
Embedded Stress Absorber in Package
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US125507922026
Semiconductor Package and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US125507572026
Chip Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US125388522026
Package Structure Containing Chip Structure with Inclined Sidewalls
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US125123992025
Semiconductor Package and Method of Manufacture
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US125002082025
Integrated Fan-out Package Having Stress Release Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124890272025
Semiconductor Device and Method of Manufacture
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US124827802025
Chip Package Structure Including an Underfill Material Portion Comprising a Cut Region
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US124762232025
Semiconductor Package and Method of Manufacturing the Same
Taiwan Semiconducotr Manufacturing Company, Ltd.
0 cites
US124446962025
Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124314152025
Buffer Block Structures for C4 Bonding and Methods of Using the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US124245112025
High Efficiency Heat Dissipation Using Discrete Thermal Interface Material Films
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US124245322025
Bump Joint Structure with Distortion and Method Forming Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US124179702025
Method for Forming Chip Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124128272025
Semiconductor Die Package with Conductive Line Crack Prevention Design
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124068982025
Chip Package Structure with Lid
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124069362025
Semiconductor Package with Substrate Recess and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US124068972025
Package Structure with Buffer Layer Embedded in Lid Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123947522025
Multi-chip Device and Method of Formation
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123946982025
Underfill Cushion Films for Packaging Substrates and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123879912025
Manufacturing Method of Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123746362025
Semiconductor Device Package with Stress Reduction Design
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123745612025
Chip Package Structure with Ring Dam
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123681142025
Semiconductor Device Package Having Warpage Control and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123681272025
Semiconductor Chip Package Having Underfill Material Surrounding a Fan-out Package and Contacting a Stress Buffer Structure Sidewall
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123680802025
Chip Package Structure with Ring Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123622562025
Method for Forming Semiconductor Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123622582025
Thermal Module for a Semiconductor Package and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123622682025
Package Assembly Including Package Substrate with Elongated Solder Resist Opening and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123621972025
Semiconductor Die Package with Ring Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123549282025
Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123477642025
Organic Interposer Including Intra-die Structural Reinforcement Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123477932025
Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123410912025
Semiconductor Packages Having Conductive Patterns of Redistribution Structure Having Ellipse-like Shape
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123277722025
Semiconductor Package Including Stress-reduction Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123227032025
Eccentric via Structures for Stress Reduction
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123227042025
Package Structure with Underfill
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123226662025
Package Assembly Lid and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123157682025
Package Assembly Including Lid with Additional Stress Mitigating Feet and Methods of Making the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123083462025
Semiconductor Die with Tapered Sidewall in Package
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123006322025
Chip Package with Lid
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123005682025
High Efficiency Heat Dissipation Using Discrete Thermal Interface Material Films
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US122835532025
Semiconductor Die with Warpage Release Layer Structure in Package and Fabricating Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US122781562025
Semiconductor Package
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US122666352025
Semiconductor Device Package Having Dummy Dies
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US122611022025
Semiconductor Package and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122551182025
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122551192025
Package Assembly Including Liquid Alloy Thermal Interface Material (TIM) and Seal Ring Around the Liquid Alloy TIM and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US122551562025
Semiconductor Package with Riveting Structure Between Two Rings and Method for Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US122550782025
Semiconductor Devices and Methods of Manufacturing
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US122495682025
Metallization Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122438002025
Package Structure with Lid and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US122372772025
Package Structure and Methods of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122372762025
Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US122323072025
Dummy Metal Bonding Pads for Underfill Application in Semiconductor Die Packaging and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US122180802025
Package Structure with Reinforced Element
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US122180232025
Semiconductor Package and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121912942025
Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121912722025
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121837142024
Package Structures and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121763012024
Package Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121702382024
Semiconductor Die Package with Multi-lid Structures and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121548962024
Three-dimensional Integrated Circuit Packages and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121548882024
Semiconductor Package and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121486842024
Package Structure and Method
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US121320212024
Method for Fabricating Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121258222024
Method of Manufacturing a Semiconductor Device Package Having Dummy Dies
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121192962024
Encircling a Semiconductor Device with Stacked Frames on a Substrate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121130252024
Semiconductor Package with Dual Sides of Metal Routing
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121130332024
Chip Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121130062024
Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121006662024
Method for Forming Chip Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121006642024
Semiconductor Device with Curved Conductive Lines and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US120948102024
Reinforcing Package Using Reinforcing Patches
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120948282024
Eccentric via Structures for Stress Reduction
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US120877052024
Package Structure with Warpage-control Element
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120740832024
Semiconductor Die Package with Thermal Management Features
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120682602024
Semiconductor Die Package with Ring Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120573632024
Chip Package Structure with Multiple Gap-filling Layers and Fabricating Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120402852024
Structure and Formation Method of Chip Package with Reinforcing Structures
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120402672024
Organic Interposer Including Intra-die Structural Reinforcement Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US120339062024
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120339132024
Chip Package Structure with Lid and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120339282024
Manufacturing Method of Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120339472024
Semiconductor Package Structure and Method for Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120354752024
Semiconductor Package with Stress Reduction Design and Method for Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120338712024
Method for Forming Semiconductor Die Package with Ring Structure Comprising Recessed Parts
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120210142024
Bump Joint Structure with Distortion and Method Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US120149692024
Package Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120092782024
Package Structure with Buffer Layer Embedded in Lid Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120092762024
Semiconductor Package Including Lid with Integrated Heat Pipe for Thermal Management and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US119978422024
Dummy Metal Bonding Pads for Underfill Application in Semiconductor Die Packaging and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US119963462024
Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119904182024
Chip Package Structure with Buffer Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119843812024
Semiconductor Package Structure and Method for Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119843782024
Semiconductor Package Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119787222024
Structure and Formation Method of Package Containing Chip Structure with Inclined Sidewalls
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119730012024
Semiconductor Device and Method of Manufacture
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US119675822024
Multi-chip Device and Method of Formation
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
0 cites
US119675472024
Solder Resist Structure to Mitigate Solder Bridge Risk
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119554552024
Embedded Stress Absorber in Package
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US119159922024
Method for Forming Package Structure with Lid
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119159912024
Semiconductor Device Having First Heat Spreader and Second Heat Spreader and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119087572024
Die Corner Removal for Molding Compound Crack Suppression in Semiconductor Die Packaging and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US118943202024
Semiconductor Device Package with Stress Reduction Design and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118625492024
Semiconductor Packages Having Conductive Patterns of Redistribution Structure Having Ellipse-like Shape
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118625802024
Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118625282024
Method for Forming Semiconductor Package
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118549292023
Semiconductor Package and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118549562023
Semiconductor Die Package with Conductive Line Crack Prevention Design
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118550042023
Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118550082023
Stacking via Structures for Stress Reduction
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US118550092023
Chip Package with Lid
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118548372023
Semiconductor Devices and Methods of Manufacturing
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US118308002023
Metallization Structure and Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118308592023
Package Structures and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118239912023
Frames Stacked on Substrate Encircling Devices and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117988972023
Package Structure and Methods of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117841302023
Structure and Formation Method of Package with Underfill
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117841482023
Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117840612023
Chip Package Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117641692023
Semiconductor Device Package with Warpage Control Structure
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US117568732023
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117568922023
Method for Forming Chip Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117568542023
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117496442023
Semiconductor Device with Curved Conductive Lines and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US117423222023
Integrated Fan-out Package Having Stress Release Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117282562023
Reinforcing Package Using Reinforcing Patches
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117282842023
Chip Package Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117282332023
Chip Package Structure with Ring Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US117216442023
Semiconductor Package with Riveting Structure Between Two Rings and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US117216432023
Package Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117157312023
Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117054202023
Multi-bump Connection to Interconnect Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US117054062023
Package Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116996682023
Semiconductor Device Package Having Warpage Control and Method of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116996312023
Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116949742023
Semiconductor Die with Warpage Release Layer Structure in Package and Fabricating Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116949412023
Semiconductor Die Package with Multi-lid Structures and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116826022023
Semiconductor Device and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116769162023
Structure and Formation Method of Package with Warpage-control Element
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116768262023
Semiconductor Die Package with Ring Structure for Controlling Warpage of a Package Substrate
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116706012023
Stacking via Structures for Stress Reduction
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116520372023
Semiconductor Package and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116370872023
Multi-chip Device and Method of Formation
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
0 cites
US116108352023
Organic Interposer Including Intra-die Structural Reinforcement Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US116056002023
Package Structure with Reinforced Element and Formation Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116005752023
Method for Forming Chip Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115944772023
Semiconductor Package and Method of Manufacturing Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115748612023
Semiconductor Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115575592023
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites