Patents/Inventors

Kuan-lin Ho

HsinchuTW14 patents

15 Patents

US124245622025
Three-dimensional (3D) Package
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US124179692025
Semiconductor Structure and Circuit Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123478022025
Die Corner Removal for Underfill Crack Suppression in Semiconductor Die Packaging
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US121659462024
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120626042024
Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119729562024
Lid Attach Process and Dispenser Head
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119088352024
Semiconductor Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US118943122024
Semiconductor Packages and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US118240322023
Die Corner Removal for Underfill Crack Suppression in Semiconductor Die Packaging
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US118108472023
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117841062023
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117495942023
Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116886932023
Semiconductor Packages and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116160372023
Integrated Fan-out Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115944792023
Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites