54 Patents
- 0 cites
- 0 cites
- 0 cites
- US126105612026Method for Fabricating a Semiconductor Device Having Back Gate Electrodes, Active Layers, and Data Lines
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- 0 cites
- 0 cites
- 0 cites
- US125324492026Semiconductor Memory Device and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- 0 cites
- 0 cites
- US124890562025Semiconductor Device Having an Upper End of a Lower Spacer Structure on a Level Same as or Lower Than a Lower End of a Storage Node Contact
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- 0 cites
- 0 cites
- US124647702025Semiconductor Devices Having Vertical Channel Transistor Structures and Methods of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites - US124530822025Semiconductor Device Having a Cell Separation Pattern in Contact with the Bit Line Contact
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US124395872025Semiconductor Device Having an Air Gap Surrounding a Portion of a Conductive Contact Layer
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- 0 cites
- 0 cites
- US124262432025Semiconductor Memory Device and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US124190492025Semiconductor Memory Device Including Symmetrical Channel Patterns and Wordlines
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- 0 cites
- US123025512025Semiconductor Memory Device and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- 0 cites
- 0 cites
- 0 cites
- US120481412024Semiconductor Memory Device and a Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US119800252024Semiconductor Device Including Carbon-containing Contact Fence
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- US119087972024Integrated Circuit Device Having a Bit Line and a Main Insulating Spacer with an Extended Portion
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- 0 cites
- 0 cites
- 0 cites
- 0 cites
- 0 cites
- US117168182023Embedded-type Transparent Electrode Substrate and Method for Manufacturing Same
LG CHEM, Ltd.
0 cites - 0 cites
- 0 cites
- 0 cites
- US116160662023Semiconductor Device and Manufacturing Method of the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US116005702023Semiconductor Memory Device and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- 0 cites
- US115630052023Three-dimensional Semiconductor Device with a Bit Line Perpendicular to a Substrate
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites