Jinsoo Bae

3 Patents

• US125688222026

  Semiconductor Module Including a Clip Structure

  Samsung Electronics Co., Ltd.

  0 cites
• US119618242024

  Semiconductor Package Including Stacked Chip Structure

  Samsung Electronics Co., Ltd.

  0 cites
• US117354912023

  Semiconductor Package Device

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites