Patents/Inventors

Jerome Teysseyre

SingaporeSG31 patents

27 Patents

USD11137762026
Power Module Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US125435792026
Dual Side Cooled Power Module with Three-dimensional Direct Bonded Metal Substrates
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124890802025
Flexible Clip with Aligner Structure
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124712042025
Semiconductor Device Modules
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124631032025
Sic MOSFET Semiconductor Packages and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
USD10980552025
Power Module Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
USD10954742025
Power Module Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124179992025
Semiconductor Packages Using Package in Package Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123083642025
Power Module Package for Direct Cooling Multiple Power Modules
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122939552025
High Power Module Package Structures
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122665902025
Dual Side Direct Cooling Semiconductor Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122305512025
Immersion Direct Cooling Modules
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122059182025
Submodule Semiconductor Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US121425512024
Package Including Multiple Semiconductor Devices
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US120876772024
Molded Packaging for Wide Band Gap Semiconductor Devices
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US120741602024
Isolated 3D Semiconductor Device Package with Transistors Attached to Opposing Sides of Leadframe Sharing Leads
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119887432024
Molded Proximity Sensor
STMICROELECTRONICS PTE Ltd
0 cites
US119844242024
Semiconductor Packages Using Package in Package Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119358172024
Power Device Module with Dummy Pad Die Layout
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119088262024
Flexible Clip with Aligner Structure
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US118483202023
Power Module Package for Direct Cooling Multiple Power Modules
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US118107752023
High Power Module Package Structures
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US117355082023
Vertical and Horizontal Circuit Assemblies
SEMICONDUCTOR COMONENTS INDUTRIES, LLC
0 cites
US116212032023
Sic MOSFET Semiconductor Packages and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116160062023
Semiconductor Package with Heatsink
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116108322023
Heat Transfer for Power Modules
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US115454212023
Package Including Multiple Semiconductor Devices
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites