20 Patents
- 0 cites
- US123827442025Stacked Substrate Structure with Inter-tier Interconnection
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US123242582025Image Sensor with Improved Quantum Efficiency Surface Structure
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - 0 cites
- US121913272025CMOS Image Sensor Having Indented Photodiode Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121425692024Integrated Chip for Standard Logic Performance Improvement Having a Back-side Through-substrate-via and Method for Forming the Integrated Chip
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120818662024Image Sensor Including Light Shielding Layer and Patterned Dielectric Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120682712024Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US120108262024Semiconductor Device Having a Butted Contact and Method of Forming
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US118430072023CMOS Image Sensor Having Indented Photodiode Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US118174702023Stacked Substrate Structure with Inter-tier Interconnection
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118174722023Anchor Structures and Methods for Uniform Wafer Planarization and Bonding
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - 0 cites
- US117569132023Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117065252023Image Sensor Including Light Shielding Layer and Patterned Dielectric Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116109012023Semiconductor Device Having a Butted Contact, Method of Forming and Method of Using
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites