62 Patents
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- US125580592026Body Cavity Insertion-type Ultrasound Probe and Method of Manufacturing Acoustic Matching Layer
FUJIFILM Corporation
0 cites - US125514452026Lipid Nanoparticle Lyophilized Composition
NATIONAL UNIVERSITY CORPORATION CHIBA UNIVERSITY
0 cites - US125470962026Developing Apparatus, Process Cartridge, and Image-forming Apparatus
Canon Kabushiki Kaisha
0 cites - US125045482025Measuring Device, Measuring Method, Measuring System, and Radiation Therapy System
SUMITOMO HEAVY INDUSTRIES, Ltd.
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- US124811082025Faraday Rotator Interconnect as a Through-via Configuration in a Patch Architecture
Intel Corporation
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- US124446722025Hybrid Bonding Technologies with Thermal Expansion Compensation Structures
Intel Corporation
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- US123685112025Embedded Faraday Rotators and Components for Increasing Bandwidth And/or Reducing Fiber Count in Photonics Multi Chip Packages
Intel Corporation
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- US123257802025Organic Fiber-reinforced Resin Formed Body and Method for Producing the Same
FURUKAWA ELECTRIC CO., Ltd.
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- US122821742025Converting Multiple Light Signals Into and Out of a Single Wavelength with Multiple Polarizations to Increase Optical Bandwidth
Intel Corporation
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- US121956142025Cellulose Fiber-reinforced Polypropylene Resin Formed Body and Method for Producing the Same
FURUKAWA ELECTRIC CO., Ltd.
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- US120645132024Cationic Lipid Exhibiting Improved Intracellular Dynamics
NATIONAL UNIVERSITY CORPORATION CHIBA UNIVERSITY
0 cites - US120570122024Mobile Object Monitoring System and Mobile Object Monitoring Method
HONDA MOTOR CO., Ltd.
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- US120365322024Exhaust Gas Purification Catalyst and Exhaust Gas Purification System Using the Exhaust Gas Purification Catalyst
MITSUI MINING & SMELTING CO., Ltd.
0 cites - US120146282024Mobile Object Monitoring System and Mobile Object Monitoring Method
HONDA MOTOR CO., Ltd.
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- US119488482024Subtractive Etch Resolution Implementing a Functional Thin Metal Resist
Intel Corporation
0 cites - US119358572024Surface Finishes with Low RBTV for Fine and Mixed Bump Pitch Architectures
Intel Corporation
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- US119088212024Sacrificial Dielectric for Lithographic via Formation to Enable via Scaling in High Density Interconnect Packaging
Intel Corporation
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- US118290872023Image Forming Apparatus with Image Bearing Members Having Different Surface Layer Thicknesses
Canon Kabushiki Kaisha
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- US117216312023Via Structures Having Tapered Profiles for Embedded Interconnect Bridge Substrates
Intel Corporation
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- US115748742023Package Architecture Utilizing Photoimageable Dielectric (PID) for Reduced Bump Pitch
Intel Corporation
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