Chien Hung Chen

4 Patents

• US126160272026

  Semiconductor Package Structures and Methods of Forming the Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US123157682025

  Package Assembly Including Lid with Additional Stress Mitigating Feet and Methods of Making the Same

  Taiwan Semiconductor Manufacturing Company Limited

  0 cites
• US122551562025

  Semiconductor Package with Riveting Structure Between Two Rings and Method for Forming the Same

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US117216442023

  Semiconductor Package with Riveting Structure Between Two Rings and Method for Forming the Same

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites