Chia-wei Ho

4 Patents

• US125506952026

  Methods of Forming an Abrasive Slurry and Methods for Chemical-mechanical Polishing

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US122241792025

  Metal Heterojunction Structure with Capping Metal Layer

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US118106432023

  Word Line Driving Circuit with High Access Efficiency

  UNITED MICROELECTRONICS Corp.

  0 cites
• US116370212023

  Metal Heterojunction Structure with Capping Metal Layer

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites