Patents/Inventors

Chia-min Lin

HsinchuTW13 patents

12 Patents

US125124192025
Method of Fabricating Memory Device and Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124179692025
Semiconductor Structure and Circuit Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123581942025
Molded Semiconductor Device and Manufacturing Method of Molded Semiconductor Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123549972025
Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122305492025
Three-dimensional Integrated Circuit Structures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122180822025
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120118592024
Molding Apparatus and Manufacturing Method of Molded Semiconductor Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118612832024
Placement Method and Non-transitory Computer Readable Storage Medium
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118550062023
Memory Device, Package Structure and Fabricating Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118108472023
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117313272023
Molding Apparatus and Manufacturing Method of Molded Semiconductor Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115944792023
Semiconductor Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites