Patents/Inventors

Cheng-hsiung Tsai

MiaoliTW15 patents

16 Patents

US124761422025
Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124446762025
Self-aligned via for Interconnect Structure
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US122283952025
Substrate Position Calibration for Substrate Supports in Substrate Processing Systems
APPLIED MATERIALS, Inc.
0 cites
US121659202024
Semiconductor Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
USD10403042024
Deposition Ring for Physical Vapor Deposition Chamber
APPLIED MATERIALS, Inc.
0 cites
US120465512024
Interconnect Structure Having a Barrier Layer Along the Sidewall of Self-aligned via Structures
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US119617232024
Process Kit Having Tall Deposition Ring for PVD Chamber
APPLIED MATERIALS, Inc.
0 cites
US119553622024
Substrate Support for Reduced Damage Substrate Backside
APPLIED MATERIALS, Inc.
0 cites
US118548202023
Spacer Etching Process for Integrated Circuit Design
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118486082023
Circuit and Method for Controlling Switching Regulator with Ultrasonic Mode
ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
0 cites
US118309102023
Semiconductor Structure Having Air Gaps and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117721372023
Reactive Cleaning of Substrate Support
Applied Materials, Inc.
0 cites
US116768622023
Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US116294092023
Inline Microwave Batch Degas Chamber
APPLIED MATERIALS, Inc.
0 cites
US116316392023
Method of Fabricating Self-aligned via Structures
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US115691242023
Interconnect Structure Having an Etch Stop Layer Over Conductive Lines
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites