Patents/Inventors

Akihiro Terasaka

TokyoJP4 patents

5 Patents

US123508902025
Composite Material Bonding Apparatus and Composite Material Bonding Method
MITSUBISHI HEAVY INDUSTRIES, Ltd.
0 cites
US122145772025
Composite Structure Manufacturing Method and Composite Structure Manufacturing Device
MITSUBISHI HEAVY INDUSTRIES, Ltd.
0 cites
US120598522024
Composite Material Molding Method and Composite Material Molding Device
MITSUBISHI HEAVY INDUSTRIES, Ltd.
0 cites
US120174242024
Fitting Method and Repair Method
MITSUBISHI HEAVY INDUSTRIES, Ltd.
0 cites
US119451792024
Method and Device for Molding Laminate
MITSUBISHI HEAVY INDUSTRIES, Ltd.
0 cites