Patents/Assignees

Yamaha Robotics Co., Ltd.

20 patents in portfolio

US12616049utility2026
Wire Bonding Device, Maintenance Method and Non-transitory Computer-readable Recording Medium Recording Program
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US12589529utility2026
Resin Sealing Apparatus
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US12575368utility2026
Apparatus for Producing Semiconductor Device, and Method for Producing Semiconductor Device
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US12568792utility2026
Semiconductor Device Manufacturing Device and Manufacturing Method
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US12563999utility2026
Manufacturing Apparatus and Manufacturing Method of Semiconductor Device
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US12557600utility2026
Semiconductor Device Manufacturing Device and Manufacturing Method
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US12557682utility2026
Mounting Device Comprising Semiconductor Chip Mounted Through Thermo-compression Tool and Mounting Method Thereof
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US12551926utility2026
Ultrasonic Horn
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US12494386utility2025
Electronic Component Cleaning Apparatus
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US12485460utility2025
Acoustic Foreign Matter Removal Device
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US12485586utility2025
Mold Clamping Device
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US12487076utility2025
Measurement Device, Measurement Method, and Bonding System
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US12487206utility2025
Defect Detection Device and Defect Detection Method
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US12489003utility2025
Wire Bonding System, Inspection Device, Wire Bonding Method, and Recording Medium
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US12489004utility2025
Surface Treatment Apparatus and Manufacturing Apparatus for Semiconductor Device
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US12480762utility2025
Mounting Device, and Method for Detecting Degree of Parallelism of Mounting Device
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US12479135utility2025
Resin-sealing Method
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US12475551utility2025
Manufacturing Apparatus of Semiconductor Device and Manufacturing Method of Semiconductor Device
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US12476219utility2025
Wire Bonding State Determination Method and Device Using a Prescribed Electric Waveform
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US12469727utility2025
Defect Detection Device and Defect Detection Method
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