- US12269123utility2025Laser Edge Shaping for Semiconductor Wafers0 cites
- US12272660utility2025Transistor Packages with Improved Die Attach0 cites
- US12266721utility2025Field Effect Transistor with Multiple Stepped Field Plate0 cites
- US12237412utility2025Protection Structures for Semiconductor Devices with Sensor Arrangements0 cites
- US12224218utility2025Semiconductor Packages with Increased Power Handling0 cites
- US12224233utility2025Packaged Electronic Devices Having Dielectric Substrates with Thermally Conductive Adhesive Layers0 cites
- US12218202utility2025Semiconductor Device Incorporating a Substrate Recess0 cites
- US12199045utility2025Power Semiconductor Package with Improved Performance0 cites
- US12199071utility2025Compact Power Module0 cites
- USD1056862design2025Semiconductor Package0 cites
- US12176423utility2024Finfet Power Semiconductor Devices0 cites
- US12159909utility2024Power Semiconductor Device with Reduced Strain0 cites
- US12150258utility2024Dual Inline Power Module0 cites
- US12142674utility2024Gallium Nitride High-electron Mobility Transistors with P-type Layers and Process for Making the Same0 cites
- US12125701utility2024Large Dimension Silicon Carbide Single Crystalline Materials with Reduced Crystallographic Stress0 cites
- US12125806utility2024Electronic Device Packages with Internal Moisture Barriers0 cites
- US12119239utility2024Packaged Semiconductor Devices, and Package Molds for Forming Packaged Semiconductor Devices0 cites
- US12113114utility2024Transistor with Ohmic Contacts0 cites