Patents/Assignees

TOKYO ELECTRON LIMITED

1,902 patents in portfolio

US12374564utility2025
Processing Apparatus
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US12374562utility2025
Wafer Shape Control for W2W Bonding
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US12374551utility2025
Substrate Treatment Method and Substrate Treatment System
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US12374543utility2025
Recess Filling Method and Substrate Processing Apparatus
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US12374533utility2025
Plasma Processing System and Method of Mounting Annular Member
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US12374531utility2025
Plasma Processing Apparatus
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US12374526utility2025
Plasma Processing Apparatus and Plasma Processing Method
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US12368050utility2025
Plasma Processing Method and Plasma Processing Apparatus
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US12365985utility2025
Deposition Apparatus with Pressure Sensor and Shower Head on Same Plane and Deposition Method
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US12368069utility2025
Substrate Transfer Device Including Housing Provided with Fan
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US12367602utility2025
Information Processing Apparatus for Teaching Transfer Position of Substrate, Transfer Position Teaching Method, and Substrate Processing Apparatus Including the Information Processing Apparatus
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US12368027utility2025
Substrate Processing Method and Substrate Processing Apparatus
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US12368041utility2025
Cleaning Method of Cup of Substrate Processing Apparatus and Substrate Processing Apparatus
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US12368030utility2025
Deposition Method and Deposition Apparatus
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US12359302utility2025
Film Deposition Apparatus and Film Deposition Method
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US12362215utility2025
Apparatus for Transferring Substrate and Method for Transferring Substrate
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US12362304utility2025
Bonding Layer and Process of Making
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US12363956utility2025
2D Material to Integrate 3D Horizontal Nanosheets Using a Carrier Nanosheet
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US12362314utility2025
Bonding Apparatus and Bonding Method
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US12362212utility2025
Computer-readable Recording Medium, Substrate Bonding System, and Substrate Bonding Method
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