- US11784106utility2023Semiconductor Package and Manufacturing Method Thereof0 cites
- US11784124utility2023Plurality of Different Size Metal Layers for a Pad Structure0 cites
- US11784130utility2023Structure and Formation Method of Package with Underfill0 cites
- US11784148utility2023Semiconductor Package0 cites
- US11784163utility2023Stacking Structure, Package Structure and Method of Fabricating the Same0 cites
- US11784179utility2023Structure and Method of Power Supply Routing in Semiconductor Device0 cites
- US11784185utility2023Source/drain Regions in Fin Field Effect Transistors (finfets) and Methods of Forming Same0 cites
- US11784198utility2023Wide Channel Semiconductor Device0 cites
- US11784204utility2023Enhanced Trench Isolation Structure0 cites
- US11784207utility2023Method for Forming an Image Sensor0 cites
- US11784211utility2023Integrated Chip Inductor Structure0 cites
- US11784219utility2023Method for Manufacturing Semiconductor Device with Spacer Layer0 cites
- US11784218utility2023Gate Air Spacer Protection During Source/drain via Hole Etching0 cites
- US11784226utility2023Semiconductor Gate-all-around Device Having an Anti-punch-through (APT) Layer Including Carbon0 cites
- US11784240utility2023Semiconductor Device Structure with Barrier Layer0 cites
- US11784241utility2023Devices Including Gate Spacer with Gap or Void and Methods of Forming the Same0 cites
- US11784242utility2023Semiconductor Device and Method0 cites
- US11784252utility2023Semiconductor Device Structure0 cites
- US11784460utility2023Bump Bonding Structure to Mitigate Space Contamination for III-V Dies and CMOS Dies0 cites