Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

3,601 patents in portfolio

US12476140utility2025
Semiconductor Package Including Step Seal Ring and Methods Forming Same
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US12476139utility2025
Integrated Circuit Package and Method
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US12476135utility2025
Semiconductor Package and Method
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US12476109utility2025
EUV Photomask and Related Methods
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US12471311utility2025
Semiconductor Fin-like Field-effect Transistor (finfet) Device Including Source/drain Structure with Boron Doped Capping Layer
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US12469821utility2025
Packages with Multiple Types of Underfill and Method Forming the Same
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US12469814utility2025
Integrated Circuit Package and Method of Forming Same
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US12469800utility2025
Semiconductor Device
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US12469763utility2025
Package with Improved Heat Dissipation Efficiency and Method for Forming the Same
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US12469742utility2025
Shallow Trench Isolation Forming Method and Structures Resulting Therefrom
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US12469717utility2025
Systems, Methods, and Semiconductor Devices
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US12469324utility2025
Semiconductor Device with Biofet and Biometric Sensors
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US12471361utility2025
Semiconductor Device
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US12471357utility2025
Semiconductor Device and Method
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US12471346utility2025
Memory Array Isolation Structures
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US12471342utility2025
NFET with Aluminum-free Work-function Layer and Method Forming Same
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US12471317utility2025
Semiconductor Device Having Fin Structure Including Dielectric-containing Substrate with Semiconductor Surface and Method of Forming the Same
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US12464817utility2025
Semiconductor Device and Method
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US12464955utility2025
Magnetic Tunnel Junction Device and Method of Forming the Same
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US12464801utility2025
Circuit Structure with Gate Configuration
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