Patents/Assignees

STATS Chippac Pte. Ltd.

112 patents in portfolio

US11670563utility2023
Thermally Enhanced FCBGA Package
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US11670618utility2023
System-in-package with Double-sided Molding
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US11664327utility2023
Selective EMI Shielding Using Preformed Mask
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US11652065utility2023
Semiconductor Device and Method of Embedding Circuit Pattern in Encapsulant for SIP Module
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US11652088utility2023
Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-package Modules with the Same
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US11640944utility2023
Semiconductor Device and Method of Forming a Slot in EMI Shielding Layer Using a Plurality of Slot Lines to Guide a Laser
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US11616025utility2023
Selective EMI Shielding Using Preformed Mask with Fang Design
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US11610847utility2023
Laser-based Redistribution and Multi-stacked Packages
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US11594438utility2023
Semiconductor Manufacturing Device to Securely Hold Semiconductor Panels for Transport and Manufacturing Processes
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US11587882utility2023
Molded Laser Package with Electromagnetic Interference Shield and Method of Making
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US11581233utility2023
Semiconductor Device and Method of Forming Electrical Circuit Pattern Within Encapsulant of SIP Module
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US11569136utility2023
Semiconductor Device and Method of Forming Dual-sided Interconnect Structures in FO-WLCSP
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