- US11862572utility2024Laser-based Redistribution and Multi-stacked Packages0 cites
- US11842991utility2023Semiconductor Device and Method of Forming a 3D Interposer System-in-package Module0 cites
- US11830785utility2023Package with Windowed Heat Spreader0 cites
- US11823973utility2023Package with Compartmentalized Lid for Heat Spreader and EMI Shield0 cites
- US11817357utility2023Region-of-interest Positioning for Laser-assisted Bonding0 cites
- US11784133utility2023Shielded Semiconductor Package with Open Terminal and Methods of Making0 cites
- US11776861utility2023Compartment Shielding with Metal Frame and Cap0 cites
- US11769730utility2023Semiconductor Device and Method of Providing High Density Component Spacing0 cites
- US11756897utility2023Semiconductor Device and Method of Forming a Slot in EMI Shielding with Improved Removal Depth0 cites
- US11749668utility2023Pspi-based Patterning Method for RDL0 cites
- US11735489utility2023Semiconductor Device and Method of Forming Hybrid TIM Layers0 cites
- US11735530utility2023Semiconductor Device and Method of Integrating RF Antenna Interposer with Semiconductor Package0 cites
- US11735539utility2023Semiconductor Device and Method of Forming Discrete Antenna Modules0 cites
- US11728281utility2023Shielded Semiconductor Packages with Open Terminals and Methods of Making via Two-step Process0 cites
- US11715703utility2023EMI Shielding for Flip Chip Package with Exposed Die Backside0 cites
- US11688612utility2023Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die0 cites
- US11688697utility2023Emi Shielding for Flip Chip Package with Exposed Die Backside0 cites
- US11688718utility2023Semiconductor Device and Method of Controlling Warpage During LAB0 cites
- US11676911utility2023Method and Device for Reducing Metal Burrs When Sawing Semiconductor Packages0 cites