Patents/Assignees

JMJ Korea Co., Ltd.

14 patents in portfolio

US12447550utility2025
Ultrasonic Welding System and Power Module Package for Power Converting Apparatus to Which Substrate Where Connection Member Is Ultrasonic Welded by Using the Same Is Applied
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US12451410utility2025
Semiconductor Package Module Including Vertical Terminals
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US12400991utility2025
Clip Structure for Semiconductor Package and Semiconductor Package Including the Same
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US12170260utility2024
Semiconductor Package and Method of Manufacturing the Same
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USD1049065design2024
Semiconductor Package
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US12027445utility2024
System for Cooling Semiconductor Component, Method of Manufacturing the Same, and Semiconductor Package Having the System
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US11908766utility2024
Cooling System Where Semiconductor Component Comprising Semiconductor Chip and Cooling Apparatus Are Joined
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US11908824utility2024
Semiconductor Package, Method of Manufacturing the Same and Metal Bridge Applied to the Semiconductor Package
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US11823920utility2023
Apparatus for Attaching Semiconductor Parts
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US11798864utility2023
Semiconductor Package with Metal Post Having Non-vertical Structure
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US11721615utility2023
Coupled Semiconductor Package
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US11682610utility2023
Semiconductor Package with Heat Radiation Board
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US11676931utility2023
Semiconductor Package
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US11631627utility2023
Method of Manufacturing Semiconductor Having Double-sided Substrate
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