Patents/Assignees

Intel Corporation

6,756 patents in portfolio

US12288224utility2025
Adaptively Embedding Visual Advertising Content Into Media Content
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US12288166utility2025
Assessment and Response Mechanism for Autonomous Systems
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US12288153utility2025
Schedule-aware Tensor Distribution Module
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US12288141utility2025
Multi-level Caching for Dynamic Deep Learning Models
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US12288101utility2025
Technologies for Dividing Work Across Accelerator Devices
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US12288095utility2025
Methods, Systems, Apparatus, and Articles of Manufacture to Extend the Life of Embedded Processors
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US12288062utility2025
Instructions for Fused Multiply-add Operations with Variable Precision Input Operands
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US12287909utility2025
Providing a Partial Reconfiguration (PR) Bitstream to a Cloud Service Provider for PR Configuration of an Accelerator Device
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US12287843utility2025
Systems and Methods of Instructions to Accelerate Multiplication of Sparse Matrices Using Bitmasks That Identify Non-zero Elements
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US12284793utility2025
Cooling Systems, Cooling Structures and Electronic Devices and Methods for Manufacturing or Operating Cooling Systems, Cooling Structures and Electronic Devices
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US12284826utility2025
Fin End Plug Structures for Advanced Integrated Circuit Structure Fabrication
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US12284665utility2025
Apparatus, System and Method of Configuring an Uplink Transmission in a Trigger-based Multi-user Uplink Transmission
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US12284661utility2025
Method and Apparatus Used in WLAN Networks
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US12284637utility2025
Apparatus and Method Used in Wlans
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US12284576utility2025
Autonomous Mobile Robot Scaling
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US12284551utility2025
Multi-link Device (MLD) for Reporting Per-port Frame Replication and Elimination for Reliability (FRER) Capabilities Using a Per-port Frer-capabilities Object
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US12284518utility2025
UE Onboarding and Provisioning Using One Way Authentication
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US12284286utility2025
Integrity Protected Command Buffer Execution
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US12283994utility2025
Apparatus, Method, and System for Performing Error Correction Based on Laser Power Setting
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US12283535utility2025
IC Die and Heat Spreaders with Solderable Thermal Interface Structures for Multi-chip Assemblies Including Solder Array Thermal Interconnects
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