Patents/Assignees

FUJIMI INCORPORATED

51 patents in portfolio

US12606444utility2026
Method for Manufacturing Silica Sol
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US12606709utility2026
Method for Increasing Specific Surface Area of Titanium Phosphate Plate-shaped Particles, and Powder Containing Plate-shaped Particles Derived from Titanium Phosphate
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US12606718utility2026
Polishing Composition, Polishing Method, and Method of Manufacturing Semiconductor Substrate
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US12590225utility2026
Polishing Composition, Polishing Method, and Method for Producing Polished Substrate
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US12584083utility2026
Surface Treatment Composition, Surface Treatment Method, and Method for Producing Semiconductor Substrate
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US12577430utility2026
Polishing Composition Containing Zirconia Particles and an Oxidizer
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US12503403utility2025
Method of Producing Aluminum Hydroxide-coated Sic Particles, Dispersion Solution and Molded Body Containing Same, and Sintered Body Formed Using Same
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US12497540utility2025
Polishing Composition and Polishing Method Using the Same
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US12454629utility2025
CMP Slurries
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US12447533utility2025
Powder Material for Use in Additive Layer Manufacturing, Additive Layer Manufacturing Method Using Same, and Molded Article
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US12448544utility2025
Chemical Mechanical Polishing Compositions and Methods of Use Thereof
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US12404475utility2025
Surface Treatment Composition, Surface Treatment Method, and Method for Producing Semiconductor Substrate
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US12398294utility2025
Polishing Composition, Polishing Method, and Method of Manufacturing Semiconductor Substrate
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US12391848utility2025
Polishing Composition, Method for Producing Polishing Composition, Polishing Method, and Method for Producing Semiconductor Substrate
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US12378437utility2025
Polishing Composition, Concentrated Liquid Thereof, and Polishing Method Using the Same
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US12378116utility2025
Titanium Phosphate Powder, Production Method Therefor, and White Pigment for Cosmetics
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US12371331utility2025
Method for Producing Silica Sol
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US12312499utility2025
Surface Treatment Method, Method for Producing Semiconductor Substrate Including the Surface Treatment Method, Composition for Surface Treatment, and System for Producing Semiconductor Substrate Including the Composition for Surface Treatment
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US12269970utility2025
Polishing Composition, Polishing Method and Method for Producing Semiconductor Substrate
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US12264265utility2025
Concentrated Liquid of Polishing Composition and Polishing Method Using Same
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