- US11705337utility2023Tungsten Defluorination by High Pressure Treatment0 cites
- US11705354utility2023Substrate Handling Systems0 cites
- US11705365utility2023Methods of Micro-via Formation for Advanced Packaging0 cites
- USD0992611design2023Mainframe of Substrate Processing System0 cites
- US11705490utility2023Graded Doping in Power Devices0 cites
- US11701749utility2023Monitoring of Vibrations During Chemical Mechanical Polishing0 cites
- US11702731utility2023Method for Forming a Film of an Oxide of In, Ga, and Zn0 cites
- US11702733utility2023Methods for Depositing Blocking Layers on Conductive Surfaces0 cites
- US11702738utility2023Chamber Processes for Reducing Backside Particles0 cites
- US11702742utility2023Methods of Forming Nucleation Layers with Halogenated Silanes0 cites
- US11702744utility2023Metal Oxyfluoride Film Formation Methods0 cites
- US11699570utility2023System and Method for Hi-precision Ion Implantation0 cites
- US11698506utility2023Carrier Mechanism for Cleaning and Handling0 cites
- US11697888utility2023Methods of Reducing or Eliminating Deposits After Electrochemical Plating in an Electroplating Processor0 cites
- US11697887utility2023Multi-compartment Electrochemical Replenishment Cell0 cites
- USD0991994design2023Mainframe of Substrate Processing System0 cites
- US11697879utility2023Methods for Depositing Sacrificial Coatings on Aerospace Components0 cites
- US11697875utility2023Method and Apparatus for Supplying Improved Gas Flow to a Processing Volume of a Processing Chamber0 cites
- US11697877utility2023High Temperature Face Plate for Deposition Application0 cites
- US11697187utility2023Temperature-based Assymetry Correction During CMP and Nozzle for Media Dispensing0 cites