Patents/Assignees

ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES Inc.

141 patents in portfolio

US12153222utility2024
Bonded Optical Devices
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US12154880utility2024
Method and Structures for Low Temperature Device Bonding
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US12136605utility2024
Layer Structures for Making Direct Metal-to-metal Bonds at Low Temperatures in Microelectronics and Method for Forming the Same
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US12132020utility2024
Low Temperature Bonded Structures
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US12125784utility2024
Interconnect Structures
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US12113056utility2024
Stacked Dies and Methods for Forming Bonded Structures
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US12100676utility2024
Low Temperature Bonded Structures
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US12100684utility2024
Bonded Structures
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US12080672utility2024
Direct Gang Bonding Methods Including Directly Bonding First Element to Second Element to Form Bonded Structure Without Adhesive
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US12068278utility2024
Processed Stacked Dies
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US12057383utility2024
Bonded Structures with Integrated Passive Component
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US12051621utility2024
Microelectronic Assembly from Processed Substrate
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US12046482utility2024
Microelectronic Assemblies
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US12046569utility2024
Integrated Device Packages with Integrated Device Die and Dummy Element
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US12046571utility2024
Low Temperature Bonded Structures
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US12046583utility2024
Electrical Redundancy for Bonded Structures
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US12033943utility2024
Laterally Unconfined Structure
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US12009338utility2024
Dimension Compensation Control for Directly Bonded Structures
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US11978681utility2024
Mitigating Surface Damage of Probe Pads in Preparation for Direct Bonding of a Substrate
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US11967575utility2024
Bond Enhancement Structure in Microelectronics for Trapping Contaminants During Direct-bonding Processes
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