Thermal Processing Chamber for a Semiconductor

FIG. 1 is a front, top and right side perspective view of a thermal processing chamber for a semiconductor, showing our new design; FIG. 2 is a front elevational view thereof; FIG. 3 is a right side elevational view thereof; FIG. 4 is a left side elevational view thereof; FIG. 5 is a rear elevational view thereof; FIG. 6 is a top plan view thereof; FIG. 7 is a bottom plan view thereof; FIG. 8 is a cross sectional view taken along line 8 - 8 in FIG. 2 ; and, FIG. 9 is an enlarged portion view taken from encircled portion labeled, “ FIG. 9 ,” in FIG. 8 . The dot-dashed broken lines shown in FIGS. 8 and 9 represent the boundaries of the enlarged portion view of FIG. 9 and form no part of the claimed design.