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Patents/USD1070796

Stamp Component for Transferring Microstructure

USD1070796No. D 1,070,796designGranted 4/15/2025

Claims (1)

Claim 1 (Independent)

The ornamental design for a stamp component for transferring microstructure, as shown and described.

Full Description

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FIG. 1 is a perspective view of a stamp component for transferring microstructure, showing our new design;

FIG. 2 is a front elevational view thereof, the rear elevational view, left side elevational view, and right side elevational view being identical;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is an enlarged portion view labeled, “ 5 ,” in FIG. 1 ;

FIG. 6 is an enlarged portion view labeled, “ 6 ,” in FIG. 5 ;

FIG. 7 is an enlarged portion view labeled, “ 7 ,” in FIG. 2 ; and,

FIG. 8 is an enlarged portion view labeled, “ 8 ,” in FIG. 7 .

The dot-dashed lines depict the boundaries of the enlarged portion views of FIGS. 5 - 8 in FIGS. 1 , 2 , and 5 - 8 and form no part of the claimed design.

Citations

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