Stamp Component for Transferring Microstructure
Claims (1)
The ornamental design for a stamp component for transferring microstructure, as shown and described.
Full Description
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FIG. 1 is a perspective view of a stamp component for transferring microstructure, showing our new design;
FIG. 2 is a front elevational view thereof, the rear elevational view, left side elevational view, and right side elevational view being identical;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is an enlarged portion view labeled, “ 5 ,” in FIG. 1 ;
FIG. 6 is an enlarged portion view labeled, “ 6 ,” in FIG. 5 ;
FIG. 7 is an enlarged portion view labeled, “ 7 ,” in FIG. 2 ; and,
FIG. 8 is an enlarged portion view labeled, “ 8 ,” in FIG. 7 .
The dot-dashed lines depict the boundaries of the enlarged portion views of FIGS. 5 - 8 in FIGS. 1 , 2 , and 5 - 8 and form no part of the claimed design.
Citations
This patent cites (43)
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