Claims (1)
The ornamental design for a heat sink for memory module, as shown and described.
Full Description
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FIG. 1 is a perspective view of a heat sink for memory module of the claimed design;
FIG. 2 is another perspective view thereof;
FIG. 3 is another perspective view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a right side elevational view thereof;
FIG. 8 is a top plan view thereof;
FIG. 9 is a bottom plan view thereof;
FIG. 10 is an enlarged view illustrating the details of the dot-dash area “ 10 ” shown in FIG. 1 ;
FIG. 11 is an enlarged view illustrating the details of the dot-dash area “ 11 ” shown in FIG. 2 ; and,
FIG. 12 is an enlarged view illustrating the details of the dot-dash area “ 12 ” shown in FIG. 3 .
The broken lines in the drawings depict portions of the heat sink for memory module that form no part of the claimed design.
The dot-dash lines in the figures represent the boundaries of the enlarged areas in which the dot-dash lines form no part of the claimed design.
Citations
This patent cites (8)
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