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Patents/USD1061464

Heat Sink for Memory Module

USD1061464No. D 1,061,464designGranted 2/11/2025

Claims (1)

Claim 1 (Independent)

The ornamental design for a heat sink for memory module, as shown and described.

Full Description

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FIG. 1 is a perspective view of a heat sink for memory module of the claimed design;

FIG. 2 is another perspective view thereof;

FIG. 3 is another perspective view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a right side elevational view thereof;

FIG. 8 is a top plan view thereof;

FIG. 9 is a bottom plan view thereof;

FIG. 10 is an enlarged view illustrating the details of the dot-dash area “ 10 ” shown in FIG. 1 ;

FIG. 11 is an enlarged view illustrating the details of the dot-dash area “ 11 ” shown in FIG. 2 ; and,

FIG. 12 is an enlarged view illustrating the details of the dot-dash area “ 12 ” shown in FIG. 3 .

The broken lines in the drawings depict portions of the heat sink for memory module that form no part of the claimed design.

The dot-dash lines in the figures represent the boundaries of the enlarged areas in which the dot-dash lines form no part of the claimed design.

Citations

This patent cites (8)

  • USD702689
  • USD702690
  • USD717744
  • USD733145
  • USD842304
  • USD862402
  • USD964947
  • USD1035597